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1

Geometric size effect on IMC growth and elements diffusion in Cu/Sn/Cu solder joints

Zhu, Yan, Sun, Fenglian

Journal:

Soldering & Surface Mount Technology

Year:

2017

Language:

english

File:

PDF, 338 KB

english, 2017

2

Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

Zhang, Hao, Liu, Yang, Wang, Lingen, Sun, Fenglian, Fan, Xuejun, Zhang, Guoqi

Journal:

Results in Physics

Year:

2018

Language:

english

File:

PDF, 1.34 MB

english, 2018

3

Characterization of interfacial IMCs in low-Ag Sn–Ag–xCu–Bi–Ni solder joints

Yang Liu, Fenglian Sun, Yang Liu

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 587 KB

english, 2013

4

Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

Liu, Yang, Sun, Fenglian, Liu, Yang, Li, Xuemei

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 1.41 MB

english, 2014

5

Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

Liu, Yang, Zhang, Hao, Sun, Fenglian

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2016

Language:

english

File:

PDF, 2.02 MB

english, 2016

6

Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging

Zhu, Yan, Sun, Fenglian

Journal:

Journal of Electronic Packaging

Year:

2016

Language:

english

File:

PDF, 1.35 MB

english, 2016

7

Effect of nano-Cu addition on microstructure evolution of Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Ban, Gaofang, Sun, Fenglian, Liu, Yang, Cong, Shaonan

Journal:

Soldering & Surface Mount Technology

Year:

2017

Language:

english

File:

PDF, 743 KB

english, 2017

8

Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes

Liu, Yang, Fu, Haifeng, Zhang, Hao, Sun, Fenglian, Wang, Xuan, Zhang, Guoqi

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2017

Language:

english

File:

PDF, 3.05 MB

english, 2017

9

A review of Garra (Teleostei: Cypriniformes) from two rivers in West Yunnan, China with description of a new species

SUN, CHAO, LI, XU, ZHOU, WEI, LI, FENGLIAN

Journal:

Year:

2018

Language:

english

File:

PDF, 9.70 MB

english, 2018

10

Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints

Kong, Xiangxia, Zhai, Junjun, Sun, Fenglian, Liu, Yang, Zhang, Hao

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 1.47 MB

2020

11

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - A comparison of two board level mechanical tests-drop impact and vibration shock

Yang, Liu, Fenglian, Sun, Hongwu, Zhang, Zhen, Zhou, Yong, Qin

Year:

2011

Language:

english

File:

PDF, 159 KB

english, 2011

12

Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

Yang Liu, Fenglian Sun, Hongwu Zhang, Pengfei Zou

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2012

Language:

english

File:

PDF, 907 KB

english, 2012

13

Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging

Li, Xuemei, Sun, Fenglian, Liu, Yang, Zhang, Hao, Xin, Tong

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 785 KB

english, 2014

14

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Liu, Yang, Leung, Stanley Y.Y., Zhao, Jia, Wong, Cell K.Y., Yuan, Cadmus A., Zhang, Guoqi, Sun, Fenglian, Luo, Liangliang

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.58 MB

english, 2014

15

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Liu, Yang, Meerwijk, Joost, Luo, Liangliang, Zhang, Honglin, Sun, Fenglian, Yuan, Cadmus A., Zhang, Guoqi

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2014

Language:

english

File:

PDF, 1.63 MB

english, 2014

16

Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering

Yang Liu,, Jia Zhao,, Yuan, Cadmus Chang-Ann, Zhang, Guoqi Q., Fenglian Sun,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.50 MB

english, 2014

17

Failure study of solder joints subjected to random vibration loading at different temperatures

Zhang, Hongwu, Liu, Yang, Wang, Jian, Sun, Fenglian

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2015

Language:

english

File:

PDF, 1.04 MB

english, 2015

18

Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

Liu, Yang, Sun, Fenglian, Luo, Liangliang, Yuan, Cadmus A., Zhang, Guoqi

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 3.09 MB

english, 2015

19

Electrodeposited Conducting Polyaniline Nanowire Arrays Aligned on Carbon Nanotubes Network for High Performance Supercapacitors and Sensors

Hui, Ni, Chai, Fenglian, Lin, Peipei, Song, Zhiling, Sun, Xiaotian, Li, Yinan, Niu, Shuyan, Luo, Xiliang

Journal:

Electrochimica Acta

Year:

2016

Language:

english

File:

PDF, 1.27 MB

english, 2016

20

Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes

Liu, Yang, Fu, Haifeng, Sun, Fenglian, Zhang, Hao, Kong, Xiangxia, Xin, Tong

Journal:

Journal of Materials Processing Technology

Year:

2016

Language:

english

File:

PDF, 1.50 MB

english, 2016

21

Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes

Zhang, Hao, Liu, Yang, Sun, Fenglian, Ban, Gaofang, Fan, Jiajie

Journal:

Microelectronics International

Year:

2017

Language:

english

File:

PDF, 306 KB

english, 2017

22

Effects of Micro Solder Joint Geometry on Interfacial IMC Growth Rate

Sun, Fenglian, Zhu, Yan, Li, Xuemei

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 1.02 MB

english, 2017

23

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Zhang, Hao, Liu, Yang, Wang, Lingen, Fan, Jiajie, Fan, Xuejun, Sun, Fenglian, Zhang, Guoqi

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 856 KB

english, 2018

24

Phosphorus efficiency, soil phosphorus dynamics and critical phosphorus level under long-term fertilization for single and double cropping systems

Khan, Asif, Lu, Guoyan, Ayaz, Muhammed, Zhang, Hongtao, Wang, Renjie, Lv, Fenglian, Yang, Xueyun, Sun, Benhua, Zhang, Shulan

Journal:

Agriculture, Ecosystems & Environment

Year:

2018

Language:

english

File:

PDF, 1.58 MB

english, 2018

25

Thermal and mechanical properties of micro Cu doped Sn58Bi solder paste for attaching LED lamps

Zhang, Hao, Sun, Fenglian, Liu, Yang

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 2.08 MB

english, 2018

26

Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

Zhang, Hao, Liu, Yang, Wang, Lingen, Sun, Fenglian, Fan, Jiajie, Placette, Mark D., Fan, Xuejun, Zhang, Guoqi

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 1.63 MB

english, 2018

27

3D-printed breast phantom for multi-purpose and multi-modality imaging

He, Yaoyao, Liu, Yulin, Dyer, Brandon A., Boone, John M., Liu, Shanshan, Chen, Tiao, Zheng, Fenglian, Zhu, Ye, Sun, Yong, Rong, Yi, Qiu, Jianfeng

Journal:

Quantitative Imaging in Medicine and Surgery

Year:

2019

Language:

english

File:

PDF, 3.09 MB

english, 2019

28

Efficient activation of peroxymonosulfate by a novel catalyst prepared directly from electrolytic manganese slag for degradation of recalcitrant organic pollutes

Li, Mengke, Huang, Fenglian, Hu, Liang, Sun, Wei, Li, Erping, Xiong, DaoLing, Zhong, Hui, He, Zhiguo

Journal:

Chemical Engineering Journal

Year:

2020

File:

PDF, 5.05 MB

2020

29

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

Han, Bangyao, Sun, Fenglian, Li, Tianhui, Liu, Yang

Journal:

Soldering & Surface Mount Technology

Year:

2019

File:

PDF, 3.14 MB

2019

30

Direct Evidence of Photoinduced Charge Transfer from Alternating Copolymer to Buckminsterfullerene

Junlin Yang, Fenglian Bai, Hongzhen Lin, Min Zheng, Yueping Zhang, Yuliang Li, Jian Sun, Yang Liu, Daoben Zhu

Journal:

Macromolecular Chemistry and Physics

Year:

2001

Language:

english

File:

PDF, 111 KB

english, 2001

31

Synthesis, crystal structure and spectroscopic properties of an unsymmetrical compound with carbazole and benzothiadiazole units

Qingguo He, Yuxi Sun, Wei Liu, Shengang Xu, Zhaokui Cao, Jiangong Cheng, Fenglian Bai

Journal:

Tetrahedron Letters

Year:

2007

Language:

english

File:

PDF, 433 KB

english, 2007

32

Adhering wear mechanism of cemented carbide cutter in the intervallic cutting of stainless steel

Fenglian Sun, Zhenjia Li, Daming Jiang, Bo Chen

Journal:

Year:

1998

Language:

english

File:

PDF, 265 KB

english, 1998

33

Synthesis and photophysical properties of a novel semiconducting polymer

Hongmin Huang, Qingguo He, Hongzhen Lin, Fenglian Bai, Zhi Sun, Qingshan Li

Journal:

Polymers for Advanced Technologies

Year:

2004

Language:

english

File:

PDF, 100 KB

english, 2004

34

A novel hyperbranched conjugated polymer for light emitting devices

Qingguo He, Hongmin Huang, Qingjiang Sun, Hongzhen Lin, Junlin Yang, Fenglian Bai

Journal:

Polymers for Advanced Technologies

Year:

2004

Language:

english

File:

PDF, 105 KB

english, 2004

35

Cleavage fracture in an Al-Li alloy 8090

Jiang Daming, Wang Yinong, Hong Bande, Lei Tingquan, Sun Fenglian

Journal:

Journal of Materials Science Letters

Year:

1996

Language:

english

File:

PDF, 2.07 MB

english, 1996

36

Amorphous molecular material containing bisthiophenyl-benzothiadiazole and triphenylamine with bipolar and low-bandgap characteristics for solar cells

Qingguo He, Chang He, Yuxi Sun, Hongxia Wu, Yongfang Li, Fenglian Bai

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 539 KB

english, 2008

37

Bonding of CVD diamond thick films using an Ag–Cu–Ti brazing alloy

Fenglian Sun, Jicai Feng, Dan Li

Journal:

Journal of Materials Processing Technology

Year:

2001

Language:

english

File:

PDF, 319 KB

english, 2001

38

Cryptococcosis in China (1985–2010): Review of Cases from Chinese Database

Chen Yuchong, Che Fubin, Chen Jianghan, Wei Fenglian, Xu Nan, Yang Minghui, Sun Yalin, Zheng Zhizhong

Journal:

Year:

2012

Language:

english

File:

PDF, 231 KB

english, 2012

39

Photo- and electroluminescence from hyperbranched phenylene vinylenes

Qingjiang Sun, Qingguo He, Chunhe Yang, Fenglian Bai, Yongfang Li

Journal:

Synthetic Metals

Year:

2003

Language:

english

File:

PDF, 131 KB

english, 2003

40

Defect structure and increased photorefractive damage resistance of ZnO highly doped congruent LiNbO3:Ho:Yb single crystals

Fan, Yexia, Xia, Shxing, Yu, Zemin, Zheng, Wei, Sun, Fenglian

Journal:

Optics Communications

Year:

2013

Language:

english

File:

PDF, 445 KB

english, 2013

41

Study of surface quality in machining nickel-based alloy Inconel 718

Fan, YiHang, Hao, ZhaoPeng, Zheng, MinLi, Sun, FengLian, Yang, ShuCai

Journal:

The International Journal of Advanced Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 764 KB

english, 2013

42

Menopausal symptoms in mid-life women in Southern China

Yang, Dongzi, Haines, C. J., Pan, Ping, Zhang, Qingxue, Sun, Yanmei, Hong, Shunjia, Tian, Fenglian, Bai, Baomin, Peng, Xueming, Chen, Weihong, Yang, Xiaohui, Chen, Yuechang, Feng, Hong, Zhao, Shuhua,

Journal:

Year:

2008

Language:

english

File:

PDF, 167 KB

english, 2008

43

[IEEE 2010 7th International Conference on Service Systems and Service Management (ICSSSM 2010) - Tokyo, Japan (2010.06.28-2010.06.30)] 2010 7th International Conference on Service Systems and Service Management - A novel multi-RTGC scheduling problem based on genetic algorithm

Wenying, Yue, Junqing, Sun, Fenglian, Liu, Peng, Yang, Mei, Han, Meiling, Feng

Year:

2010

Language:

english

File:

PDF, 163 KB

english, 2010

44

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - The influence of element-Ni on interfacial reactions between lead-free Sn-Ag-Cu and Cu substrate

Lifeng Wang,, Fenglian Sun,, Ying Liang,, Miaosen Yang,

Year:

2005

Language:

english

File:

PDF, 675 KB

english, 2005

45

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of adding some elements on solderability of Sn-0.7Ag-0.5Cu solder

Zhang, Hongwu, Sun, Fenglian, Liu, Yang

Year:

2010

Language:

english

File:

PDF, 678 KB

english, 2010

46

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Effects of Ni addition on microstructure and the shear strength of Sn-3.0Ag-0.5Cu/Cu solders joints

Lifeng Wang,, Xuwei Shen,, Fenglian Sun,, Yang Liu,

Year:

2008

Language:

english

File:

PDF, 3.09 MB

english, 2008

47

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Thermodynamic calculation-aided design Pb-free solders and related experimental research

Ying Liang,, Fenglian Sun,, Lifeng Wang,, Miaosen Yang,

Year:

2005

Language:

english

File:

PDF, 541 KB

english, 2005

48

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Improving the solderability and electromigration behavior of Low-Ag SnAgCu soldering

Fenglian, Sun, Yang, Liu, Wang Jiabing,

Year:

2011

Language:

english

File:

PDF, 1.29 MB

english, 2011

49

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Study of creep performance of Sn-0.7Ag-0.5Cu-3.5Bi-0.05Ni/Cu by nanoindentation

Miaosen, Yang, Fenglian, Sun, Xia, Li

Year:

2013

Language:

english

File:

PDF, 501 KB

english, 2013

50

[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - An idealized shape of CuCGA solder joint and its load-carrying advantage

Zhili, Zhao, Xirui, Xu, Fenglian, Sun, Zhili, Zhao

Year:

2013

Language:

english

File:

PDF, 449 KB

english, 2013

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